INNOVATIVE BOND TECHNOLOGIES
FOR YOUR PRODUCTION

A single machine as a platform for a range of applications

One of the most impressive features of the F & K Delvotec solution is its modular platform concept, enabling all wire bonding applications such as fine, heavy, wedge, ball and ribbon on a single machine.

This convenient functionality is ideally suited to your production of small and medium-sized production runs. However, it offers you additional advantages.

Change of bonding head ... and production continues

Different wire bonding processes on the same machine: with F & K Delvotec all you do is change the bond head if you wish to use varying applications. This saves space, for example in clean rooms where space is restricted, and it also avoidscost because a single machine base means reduced spare parts investment.

Product development and reducing time-to-market

A homogeneous production platform makes it possible. Converting your production as required, fast and rationally. Connections and software base can continue to be used. Transport work, operator training, maintenance and machine care are reduced, shortening your development times and getting new products to the market faster.