|
Sitemap |
Imprint |
Contact | Language:
German / English
|
|
|
|
INNOVATIVE BOND TECHNOLOGIES
|
A single machine as a platform for a range of applicationsOne of the most impressive features of the F & K Delvotec solution is its modular platform concept, enabling all wire bonding applications such as fine, heavy, wedge, ball and ribbon on a single machine.
|
![]() |
Change of bonding head ... and production continuesDifferent wire bonding processes on the same machine: with F & K Delvotec all you do is change the bond head if you wish to use varying applications. This saves space, for example in clean rooms where space is restricted, and it also avoidscost because a single machine base means reduced spare parts investment. Product development and reducing time-to-marketA homogeneous production platform makes it possible. Converting your production as required, fast and rationally. Connections and software base can continue to be used. Transport work, operator training, maintenance and machine care are reduced, shortening your development times and getting new products to the market faster. |