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TAILOR-MADE SOLUTIONS
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Preparing the ground for zero-defect productionZero-defect production is a vital topic for many industrial companies. However, the route to this does not lead via the detection and elimination of defective parts, because beyond a certain requirement threshold quality is no longer selectable. On the contrary, the answer is to produce quality from the very beginning.
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High precision ultrasonic monitoringF & K Delvotec optimises continuous quality testing with a range of highly efficient processes which inspect and test micro-electronic components during wire bonding. BPC (bond process control) optimises bonding results by tracking and regulating the ultrasonic energies which are optimal for various surface properties. The process patented for F & K Delvotec of continuously tracking transducer impedance during the bonding process supplement this procedure and makes it even more efficient. |
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In-head pull tester and in-line pull testerUltrasonic systems, test and measuring systems:
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During the bonding process itself F & K Delvotec's equipment enables reliable quality statements. For example the in-head pull tester carries out the non-destructive testing of bonded aluminium thick wire. A further integrated test makes it possible to identify lift-offs, while the in-line pull tester implements the extremely fast testing of low threaded thick-wire components and lead frames without interrupting the production process. |
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Maximum security for your production processesOne of F & K Delvotec's core performance promises involves the comprehensive safegarding of your production processes. All phases of production need to operate reliably and the result needs to be best quality products for your customers. |
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