Preparing the ground for zero-defect production

Zero-defect production is a vital topic for many industrial companies. However, the route to this does not lead via the detection and elimination of defective parts, because beyond a certain requirement threshold quality is no longer selectable. On the contrary, the answer is to produce quality from the very beginning.

F & K Delvotec faces up to this challenge. F & K Delvotec bonders help you to take the decisive step towards zero-defect production with precise control factors and measurements at every stage of production. Test components which are specially developed and patented by F & K Delvotec perfect your end product down to the last detail.

High precision ultrasonic monitoring

F & K Delvotec optimises continuous quality testing with a range of highly efficient processes which inspect and test micro-electronic components during wire bonding. BPC (bond process control) optimises bonding results by tracking and regulating the ultrasonic energies which are optimal for various surface properties. The process patented for F & K Delvotec of continuously tracking transducer impedance during the bonding process supplement this procedure and makes it even more efficient.

In-head pull tester and in-line pull tester

Ultrasonic systems, test and measuring systems:

• The in-head pull tester ensures the non-destructive test of bonded thick aluminium wire.
• The in-line pull tester enables the extremely fast checking of components made of lightly threaded thick wire or lead frames without interrupting production.
• Highly sophisticated F & K Delvotec measuring and test equipment is available to make sure that all these ultrasonic systems can be perfectly installed in the F & K Delvotec bonders.

• This equipment is suitable both for service on the bond machinery and for quality assurance. It enables the continuous documentation of the condition and function of the ultrasonic systems and can, for the first time. also be used for the precautionary maintenance of these high-precision components.

During the bonding process itself F & K Delvotec's equipment enables reliable quality statements. For example the in-head pull tester carries out the non-destructive testing of bonded aluminium thick wire. A further integrated test makes it possible to identify lift-offs, while the in-line pull tester implements the extremely fast testing of low threaded thick-wire components and lead frames without interrupting the production process.

Maximum security for your production processes

One of F & K Delvotec's core performance promises involves the comprehensive safegarding of your production processes. All phases of production need to operate reliably and the result needs to be best quality products for your customers.

A decisive factor for the achievement of this objective is BPC (bond process control), which has been patented for F & K Delvotec. This integrated process control function is integrated into every F & K Delvotec machine, efficiently combining checks on the bonding process with impedance measurement. PDF file