TAILOR-MADE SOLUTIONS
FOR THE WHOLE BONDING PROCESS
Zero-defect and post-bond inspection in wire bonding
Customers: a number of prestigious companies in the semi-conductor industry
The task:
- Wire bonds are to be checked and characterised as completely as possible.
- The checks are to be non-destructive and without time or flow-through loss.
- In addition to the lowest possible psuedo error rate, non-detected defects are to be as low as possible.
Special challenges:
Although the test instruments are to be integrated in the bonder and are therefore very compact, they also have to work just as reliably and precisely as separate test units. This places high demands on miniaturisation.
Highlights of the F & K Delvotec solution:
The F & K Delvotec solution which was implemented includes BPC and impedance check during bonding.An in-head pull tester for the non-destructive testing of all wire bonds or those which showed irregularities in the preliminary stage is part of the equipment. The integrated post-bond inspection of 100 % of components via an automatic visual inspection system means that quality control after bonding is implemented without time loss. The SPC evaluation of the generated data serves for the continuous monitoring of process reliability. In this solution F & K Delvotec's specialists have integrated all the available technology for zero-defect production, and their technological leadership in this field has been demonstrated at a number of customer facilities.
Customer benefits:
The companies which F & K Delvotec supports in the semi-conductor industry operate on best-practice criteria, because they produce with state-of-the-art technology.
Integrated F & K Delvotec products:
"The semi-conductors we produce have to meet the highest customer criteria. In particular when it comes to freedom from defects extremely strict standards are applied. It is therefore of great benefit to us that F & K Delvotec is continually setting new benchmarks in this area."
Dr. Josef Sedlmair