TAILOR-MADE SOLUTIONS
FOR THE WHOLE BONDING PROCESS

In-house ultrasonic development

Customers: a number of prestigious companies in the international semi-conductor industry

The task:

  • Ultrasonic generator and transducer are the functional core of each wire bonder.
  • Because of its wide bonding spectrum F & K Delvotec needs a much greater range of ultrasonic systems than other manufacturers: lower output for this wire bonds, higher for thick wire bonds and ultra-high output for HARB bonds.
  • Added to this are varying ultrasonic frequencies from 40 to over 140 kHz.
  • No supplier of ultrasonic systems covers this complete spectrum with adequate reliability and technological competence, which is why F & K Delvotec decided a few years ago to develop and produce its own ultrasonic systems.

Special challenges:

  • Customers in the semi-conductor industry generally prefer one-stop shopping and look for a solution which includes comprehensive hardware and all stages of the process.

Highlights of the F & K Delvotec solution:

Today's full-digital ultrasonic generators can be easily switched between different output ranges and ultrasonic frequencies. This also contain important diagnostic functions so that incorrectly clamped tools or a damaged transducer can be quickly identified. The digital generator makes it possible to integrate a range of rule algorithms into the software which are developed in the future.The ultrasonic systems and diagnostic equipment made by F & K Delvotec are also popular with the competition and are used as a matter of preference in difficult applications.

Customer benefits:

In particular with newly developed applications (e.g. coated wires, HARB) F & K Delvotec provides customers with the possibility of being the first to use technological innovations and accordingly to share its technological leadership position. They achieve better output with components which are difficult to bond (laser, MEMS). At the same time they receive considerable cost savings by reduced quality costs, optimised production volumes and minimised scrap.

Integrated F & K Delvotec products:


<<< back (Casestudy 4) | next (Casestudy 6) >>>

"Regardless of the technology with which a wire bonder is manufactured, its core is always the ultrasonic system made up of generator and transducer. The surprising this is that almost all bond manufacturers use bought-in ultrasonic systems. We took the decision to make ourselves independent of the market in this critical area and to acquire our own know-how. This is now benefiting us in diagnosing and regulating ultrasonic systems for unusual types of wire material - and has become a new business area because now even our competitors are buying our ultrasonic systems."

Dr. Farhad Farassat