TAILOR-MADE SOLUTIONS
FOR THE WHOLE BONDING PROCESS
New technologies: HARB heavy aluminium ribbon
Customers: a number of prestigious companies in the semi-conductor industry
The task:
- For leading companies in the semi-conductor industry to hold their competitive position it is necessary to raise machine productivity in comparison to current thick wire bonders significantly.
- As a additional feature retooling of the machines has to be uncomplicated.
- If possible different applications are to run on the same machine.
Special challenges:
- As a rule customers in this industry expect solutions which are both innovative and highly reliable.
Highlights of the F & K Delvotec solution:
The F & K Delvotec bonders can be quickly switched by the operator from conventional thick wire to HARB and back again without service support. At the same time all supplementary functions, the BPC and in-head pull tester, are retained in full.
Customer benefits:
Manufacturers who rely on F & K Delvotec in this field achieve much higher productivity today by the larger cross-section of the bond connection. This is of decisive importance in particular for the automotive and power management industries, because in addition to the high mechanical robustness of the bond there are also major savings in production costs.
Integrated F & K Delvotec products:
"In order to remain competitive we had to raise our productivity considerably. F & K Delvotec recommended to us a thick-wire line in which the various applications run on the same machine, requiring minimal retooling. This helped us to effectively meet the requirements of the market, product diversity and process efficiency at the same time."
Leading automotive manufacturer