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PRODUCTS
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Wire bonder-Base G5/64000DA, Deep access bonderWith the G5/64000DA model F & K Delvotec presents the deep-access version for especially demanding thin-wire applications. The machine also processes thin-ribbon materials and has a 90° wire guide for deep components. This bonder, too, can be retooled for other processes in less than 20 minutes. Its outstanding features include the newly developed dynamic bond head for dynamised and optimised loop checking. PDF file |
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ContactF & K Delvotec
service@de.fkdelvotec.com |
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