Ideal for your production: the innovative G5 series

The redesigned G5 series from F & K Delvotec is the latest machine generation for fully automatic bonding. It offers a high level of user friendliness, additional software interfaces, optimised positioning accuracy and high production speed, both for manual and automatic handling.

All G5 machines operate on the basis of a homogeneous platform. This means they can be applied in a modular manner for all bonding processes. From small series to mass production, from thin wire, thick wire, gold ball and thin ribbon down to heavy ribbon.

G5 XL – Extremely Large Area Wire Bonder

• The world's largest working area
• Designed for very large applications, like solar panels and
  e-mobility batteries
• Quality proven components from G5 family
• Exchangeable bondheads

Thin Wire Bond Head (64000)

• 17 to 75 μm wire diameter
• Bond force programmable from 10 to 250 cN
• Standard wire feed, 45° wire feed angle (optional: 60°)
• 2" wire spool

Deep Access Thin Wire Bond Head (64000DA)

• 17 to 75 μm wire diameter
• Ribbon up to 250 μm x 75 μm
• Bond force programmable from 10 to 250 cN
• 90° wire or ribbon feed
• 2“ wire spool
• Single wire clamp, cascadable with
  support clamp for secure tear-off

Heavy Wire Bond Head (66000)

• 100 μm to 600 μm wire diameter
• Bond force programmable from 50 to 2000 cN
• 90° wire feed angle
• Snap-on wire guide (patented)
• 3" and 4" wire spool
• Quick-exchange cutter blades