Over 30 patents vouch for the innovative environment at F & K Delvotec

Four highlights symbolise a range of groundbreaking technologies.

F & K Delvotec Patent: BPC Bond Process Control
Patent-No.: EP 0540189

Bond Process Control is the only usable industrial process for real-time control of bonding parameters in relation to bond development. It regulates the ultrasonic energy and bonding force based on the actual wire distortion. This allows the bonding process to be closely monitored and provides excellent quality control. It also enables fine tuning of the process and compensates for any slight fluctuations in the surface quality and bondability.

F & K Delvotec Patent: In-head pull tester
Patent-No.: EP 1333263

A number of quality-critical applications require that every wire bond be checked by means of a non-destructive pull test. The low level pull-test force applied is intended to detect any non-sticking or poorly sticking bonds. F & K Delvotec is the only manufacturer to integrate not just a simple non-sticking detector but a completely functional pull tester within the bond head. This enables testing of the first, second or both bonds, not only for poor sticking but also for slow pull-off or peeling, making process control significantly more reliable.

F & K Delvotec Patent: Self-adjusting wire guide
Patent-No.: EP 0922524

The wire feed unit must be adjusted precisely so that the wire is placed exactly at a defined place below the wedge and the bond can be executed correctly. Another of its functions is to act as a well defined brake and slow down the rate at which the wire is fed to ensure consistent loops. Because the wire guide is selected to suit a particular wire size and because it is also subject to wear and tear, it is important to be able to replace it quickly. F & K Delvotec's new development is much simpler than previously used models being a single, inexpensive injection moulded unit. Rather than being fixed on the bond head, the new design clips directly onto the wedge and self-adjusts automatically. This improves performance and, at the same time, virtually eliminates the set-up and adjustment time

F & K Delvotec Patent: Gold-bond head
Patent-No.: EP 0945208

In gold ball bonding it is essential to generate constant-sized gold balls to ensure a stable bonding process. The ball is formed by melting a defined length of gold wire. F & K Delvotec has developed a method of ensuring that this tail is always of the same length, even when the amount torn off when the bond head moves upwards is inconsistent. After the second bond, with the wire clamp fixed and the wire vertical, the capillary is moved by a defined amount. This mechanism guarantees constant tails and hence a robust bonding process, even with thick-film circuits and similar critical surfaces, in other words for applications where the tear-off of the second bond is often uncontrolled. 

F & K Delvotec Patent: Bonding head
Patent-Nr.: USA 4,781,319

F & K Delvotec Patent: Ball-Bonding
Patent-Nr.: EP 0299987

F & K Delvotec Patent: Ball bonding method and apparatus for using the same
Patent-Nr.: EP 0533164

F & K Delvotec Patent: Ball bonding method and apparatus for performing the method
Patent-Nr.: USA 4,925,083

F & K Delvotec Patent: Bonddrahtzuführung
Patent-Nr.: EP 0330053

F & K Delvotec Patent: Apparatus and Method of controlled feed of a bonding wire to the wedge of a bonding head
Patent-Nr.: USA 4,928,871

F & K Delvotec Patent: Device for monitoring wire supply and consumption
Patent-Nr.: EP 0447085

F & K Delvotec Patent: Device for monitoring wire supply and consumption
Patent-Nr.: USA 5,277,354

F & K Delvotec Patent: Bonding wedge
Patent-Nr.: USA 5,018,658

F & K Delvotec Patent: Bonding stamp
Patent-Nr.: BD 3912580

F & K Delvotec Patent: Die eject system
Patent-Nr.: EP 0447083

F & K Delvotec Patent: Wire bonding ultrasonic control
Patent-Nr.: USA 5,314,105

F & K Delvotec Patent: Control system
Patent-Nr.: GB 2270868

F & K Delvotec Patent: Reflow soldering control process
Patent-Nr.: GB 2271305

F & K Delvotec Patent: Tape automated bonding system
Patent-Nr.: GB 2271306

F & K Delvotec Patent: Tool exchange system for hybrid die bonder
Patent-Nr.: EP 0447087

F & K Delvotec Patent: Bonding head
Patent-Nr.: EP 0494510

F & K Delvotec Patent: Device Ball-Bonding
Patent-Nr.: BD 29608277.5

F & K Delvotec Patent: Bonding head
Patent-Nr.: USA 5,170,928

F & K Delvotec Patent: Device and method of wire-bonding
Patent-Nr.: EP 0649701

F & K Delvotec Patent: Bond head for ultrasonic bonding
Patent-Nr.: BD 4326478

F & K Delvotec Patent: Bonding head for an ultrasonic bonding machine
Patent-Nr.: USA 5,452,838

F & K Delvotec Patent: Wire guide for a bonding machine
Patent-Nr.: USA 5,906,706

F & K Delvotec Patent: Bonding head
Patent-Nr.: EP 0864392

F & K Delvotec Patent: Bonding head
Patent-Nr.: USA 5,950,903

F & K Delvotec Patent: Bonding head
Patent-Nr.: EP 0857535

F & K Delvotec Patent: Ultrasonic bonding head comprising a linear motor for adjusting the pressure according to a piezo detector
Patent-Nr.: USA 5,979,737

F & K Delvotec Patent: Apparatus for manual wire bonding
Patent-Nr.: USA 4,878,609

F & K Delvotec Patent: Device for wire bonding
Patent-Nr.: DE 3616651

F & K Delvotec Patent
Patent-Nr.: Japan 3276421

F & K Delvotec Patent: Device for ball bonding
Patent-Nr.: EP 0804994

F & K Delvotec Patent: Device and methode for thermo-compression bonding
Patent-Nr.: EP 0947281