English
CONSTANT INNOVATION
IN WIRE BONDING DEVELOPMENT
- 1992
Dr. Farhad Farassat and Said Kazemi aquire Delvotec in a management buy-out from Black & Decker. The new company releases its first product, the model 6319, an optimised fine wire bonder with a 4-axis bond head, with immediate success.
- 1995
The first semi-automatic machine, the model 5430 fine wire wedge bonder, is launched. Additional models, the 5410 for gold ball and 5450 for heavy wire wedge bonding follow.
- 1996
The ball-wedge bond process developed by F & K Delvotec for heavy aluminium wire can be used in those applications where space is very limited.
- 1997
The 6200/6400/6600 bonder family redefines state-of-the-art by providing a consistent platform strategy for all types of bonder and offering users an attractive range of innovations.
- 1998
The homogenous family concept is extended to cover the newly developed series 4300/4400/4500 die bonders. Efficient synergies between die and wire bonders bring long standing benefits to users.
- 1999
The capability of the model 6400 is extended by the release of a deep access bond head with a 90° wire feed allowing wire and ribbon bonding into deep, restricted access packages.
- 2000
F & K Delvotec launches its top of the range die bonder Model 4500. The most modern drive technology in the world and extremely flexible multi-chip capability make this machine the die bonder of choice for demanding, multi-chip applications.
In 2000 the high speed versions of the wire bonder models 6200/6400/6600 are released.
Annual turnover exceeds 50 million euros for the first time.
- 2001
The new 5600 bond tester offers users a completely new concept and the ability to integrate quality assurance within the production and to provide extensive statistical and evaluation capabilities at the same time.
- 2002
The first of the new epoxy/eutectic die bonders, the model 4501 are shipped.
The model 6600HS optimised for maximum throughput and flip chip capability for the model 4400/4500 die bonder series demonstrate additional innovative products.
- 2003
The model 6200 gold ball bonder is fitted with a programmable flame-off unit.
The first machines of the new G5 wire bonder generation are launched.
- 2004
F & K Delvotec launches highly accurate model 5310/5330 manual wire bonders particularly suited to prototyping and pre-production runs.
- 2005
F & K Delvotec continues to impress with innovative developments:
- PBInspect allows 100%, non-destruct inspection of all wires
- TAB bonding on the model 6400 combines new techniques with classical wire bonding
- Additional capabilities on the Combi-model 5600 enable all bonding techniques and a pull / shear test in a single machine
- The F & K subsidiary in Braunau is restructured to be an independent company with its own R&D and sales departments.
- 2006
A simple conversion kit turns the new heavy wire bonder 66000G5 into a heavy ribbon bonder for high power applications.
- 2007
The new bond head in the G5 series bonders guarantees even greater reliability by tear-off of wires or ribbons allowing all types and size of wedge to be used. F & K opens a new chapter in the automotive industry by perfecting bonding with aluminium-coated gold wire. A range of awards and prizes won by F & K Delvotec's technologies demonstrate the fascination and recognition of the industry.