CONSTANT INNOVATION
IN WIRE BONDING DEVELOPMENT

Award-winning technology

The innovativeness, intelligence and maturity of the leading bond technology of F & K Delvotec is underlined by a wide range of industry awards.

AEO

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A selection of the latest awards

The BEST Awards 2012; Highest rated wire bonder maker (VLSI RESEARCH INC.)

The BEST Awards 2011; Highest rated wire bonder maker (VLSI RESEARCH INC.)

The BEST Awards 2010; Highest rated wire bonder maker (VLSI RESEARCH INC.)

The BEST Awards 2009; Highest rated wire bonder maker (VLSI RESEARCH INC.)

10 BEST Awards 2012; Highest rated wire bonder supplier (VLSI RESEARCH INC.)

10 BEST Awards 2011; Highest rated wire bonder supplier (VLSI RESEARCH INC.)

10 BEST Awards 2010; Highest rated wire bonder supplier (VLSI RESEARCH INC.)

10 BEST Awards 2009; Highest rated wire bonder supplier (VLSI RESEARCH INC.)

Editor’s Choice
Best Product Award 2007
Awarded by Semiconductor International

Sensata Technologies Supplier Excellence Award 2006
Awarded by Sensata Technologies

Gobal Technology Award 2007
Awarded by Global SMT & Packaging