English
CONSTANT INNOVATION
IN WIRE BONDING DEVELOPMENT
Award-winning technology
The innovativeness, intelligence and maturity of the leading bond technology of F & K Delvotec is underlined by a wide range of industry awards.
A selection of the latest awards:
Editor’s Choice
Best Product Award 2007
Awarded by Semiconductor International
Sensata Technologies Supplier Excellence Award 2006
Awarded by Sensata Technologies
Gobal Technology Award 2007
Awarded by Global SMT & Packaging