CONSTANT INNOVATION
IN WIRE BONDING DEVELOPMENT

Award-winning technology

The innovativeness, intelligence and maturity of the leading bond technology of F & K Delvotec is underlined by a wide range of industry awards.

a a
 

10 BEST Awards 2011
Highest Rated Wire Bonder Supplier.
Awarded by VLSI RESEARCH INC.

10 BEST Awards 2010
Highest Rated Wire Bonder Supplier.
Awarded by VLSI RESEARCH INC.

10 BEST Awards 2009
Highest Rated Wire Bonder Supplier.
Awarded by VLSI RESEARCH INC.

A selection of the latest awards:

Editor’s Choice
Best Product Award 2007
Awarded by Semiconductor International

Sensata Technologies Supplier Excellence Award 2006
Awarded by Sensata Technologies

Gobal Technology Award 2007
Awarded by Global SMT & Packaging

 

 

Highest rated wirebonder maker (VLSI 2010)

Highest rated wirebonder maker (VLSI 2009)

THE BEST Chip Making Equipment Suppliers for 2010

The 10 BEST Suppliers of Chip Making Equipment for 2009