At F & K DELVOTEC we are very clear about quality assurance: it is better to produce the best bond quality from the start rather than to search for faults during the process. That's why we developed the Bond Process Control (BPC), the only bond process monitoring with real-time control of the bond quality.
During the actual bonding the BPC can improve the quality of the bonds. In addition the functions for the statistical control of the BPC allow continuous registration and analysis of up to 436 relevant parameters in an SDQL data bank. Other systems on the market only assess the quality of the bonds and propose changes to the parameters for subsequent bonds without controlling the actual bond.
More information on our quality tools
Fully automatic wire bonder
More flexible and reliable than any other machine family of its type in the world
The revolutionary bond concept
Robust process for simple and low cost manufacture
Highly flexible for all applications
From manual component loading to highly automated transport