Whether for semiconductors, power modules, sensors, photo-voltaic cellsor battery systems, the challenges from our customers are as varied as their products. Despite all the variations they have one thing in common: the desire for a secure, future-safe investment for their electronic manufacturing.
Hardware, Software and Automation – all of the same mould
F & K DELVOTEC chooses the most suitable wire bonder depending on the application, automates the connection to existing up-line and down-line equipment, including buffer stations and magazines and integrates the most efficient feeding system. F & K DELVOTEC Software can be coupled to third party software; as per SMEMA-Standard – with quality tools within the bonder and an open interface to quality management. Furthermore we are the only manufacturer designing and buiding all the various automation products in-house.
We support the customer during the complete product cycle. The comprehensive Know-how within F & K DELVOTEC is particularly appreciated buy those new to wire bonding technology.