One-Stop-Shopping

Everything about wire bonding from a single source

Whether for semiconductors, power modules, sensors, photo-voltaic cellsor battery systems, the challenges from our customers are as varied as their products. Despite all the variations they have one thing in common: the desire for a secure, future-safe investment for their electronic manufacturing.


Hardware, Software and Automation – all of the same mould

F & K DELVOTEC chooses the most suitable wire bonder depending on the application, automates the connection to existing up-line and down-line equipment, including buffer stations and magazines and integrates the most efficient feeding system. F & K DELVOTEC Software can be coupled to third party software; as per SMEMA-Standard – with quality tools within the bonder and an open interface to quality management. Furthermore we are the only manufacturer designing and buiding all the various  automation products in-house.

Comprehensive Process-Know-how as a bonus

We support the customer during the complete product cycle. The comprehensive Know-how within F & K DELVOTEC is particularly appreciated buy those new to wire bonding technology.

  • Pre-trial testing of bondability and product design shortens the development time and avoid any potential stumbling blocks e.g. measurment of component or wire resonance) 
  • Pre-series samples on production equipment
  • Process optimisation prior to the series production to ensure product quality and make the process as rubust as possible
  • Customer schooling and training to build-up the required technology and process know-how
  • Quality assurance through evaluation of data banks in the wire bonder

 

F & K M17 Serie

Fully automatic wire bonder
More flexible and reliable than any other machine family of its type in the world

Read more

 

Laser Bonder

The revolutionary bond concept
Robust process for simple and low cost manufacture


Read more

 

 

Handling and Automation

Highly flexible for all applications
From manual component loading to highly automated transport

Read more


Back to overview