F & K DELVOTEC presents Laserbonding on ECPE Workshop Hamburg

Dr. Hans-Georg von Ribbeck presents the newest developments and application challenge solutions of the unique Laserbonder technology from F & K DELVOTEC Bondtechnik GmbH. The audience of the Workshop "Advanced Power Packaging - Power Modules 2.0": 110 participants from all key companies in the field of Power electronics packaging. Within the field of power electronics packaging, a lot of new developments and research studies are taking place. Wide bandgap devices with their possibilities for fast switching and higher temperatures, or more robust and reliable power electronics systems for mobility and renewables push the limit. 

Link to the event