The automotive industry pioneered the platform concept. Since 1997 F & K DELVOTEC has followed this simple but ingenious manufacturing and development principle. Using tried-and-tested standard components for the complete M17 product family keeps investment costs at a minimum and ensures greater competitiveness for the customer.
Based on a homogenous technology platform, all M17 wire bonders can be used for all wire bond processes. From small series to mass production, from fine wire, heavy wire, gold ball as well as thin ribbon to heavy ribbon bonding.