As specialists for assembly and joining technologies we have been committed to continuing to develope reliable and efficient products and solutions for connecting electronic components since we were founded in 1978.
In the field of wire bonding for customers in the semiconductor, E-Mobility, Photo-Voltaic and automotive industries F & K DELVOTEC developed complete solutions for partial or full automation. The all-round service ranges from applications guidance in the selection and configuration of the wire bonding machines through to coupling of buffer stations and magazines as well as the integration of feeding systems.
The boom in the market for power electronics continues unabated. Because there is a finite physical limit to the current carrying capacity of wire bonded connections, as part of a joint project F & K DELVOTEC developed a robust and extremely reliable technology for joining aluminium and copper ribbons on DCB substrates: laser bonding.