Quality Assurance

Quality tools within the bonding process

Best bond quality from the beginning rather than detecting and removing faulty parts is the fastest way to zero defect electronic manufacturing. F & K DELVOTEC optimises permanent quality assurance through a series of highly efficient ultrasonic monitoring precedures that inspect and check the microelectronic components during wire bonding.

F & K DELVOTEC`s quality tools deliver reliable information during wire bonding.  The in-head pull tester checks the bonded heavy aluminium wire non-destructively. Another integrated test helps to identify lift-offs and the in-line pull tester checks low wire count, heavy wire bonded components such as leadframes extremely quickly without impacting the production process. The undisputed star under the F&K quality tools is the Bond Process Control BPC, the only real-time control of bond quality.

Rules of bond quality

The Bond Process Control Unit BPC, developed and patented by F & K DELVOTEC, is a fundamental milestone on the path to zero defect bonding. Aside from the monitoring of the bond parameters and storing the data in an SQL database, it is the only system world-wide that actively controls the ultrasonic energy based on wire deformation, and that not from bond 1 but during bond 1.


What makes this control so unique?

In conventional wire bonders, because of variations in the wire consistency, surface quality or degree of contamination, a constant ultrasonic energy is applied throughout all the bond phases to ensure that even the least bondable area is bonded. In practice this leads to many areas being "overbonded", which is too much energy that is applied to the bonds. 

The BPC uses a proximity sensor on the transducer to determine the wire deformation and makes it possible to regulate the ultrasonic energy based on pre-defined reference values, in real time or, more accurately, within a few milliseconds.

Other systems available on the market collect data on the quality parameters and based on this statistical data, recommend changes to be made to improve the quality of subsequent bonds.

Continously improving the bond quality

Using the database additional statistical evaluation from the analysis of up to 435 process parameters can be obtained. This allows the user to identify the cause of problem bonds that may have been caused by dust particles under the wire or contamination of the bond area or by variations in the bonding properties due to a lot of supplier changes. 

Via an open interface the SMEMA-standard-compliant F & K DELVOTEC software can be connected directly to the company`s internal quality management. Detailed collection of the relevant quality parameters of all bonds ever made, allow comparitive analysis and introduction of targeted measures for improvement.

Call the Bond Police: should the bonder stop, the detailed bond data for the two previous bonds in a highly expanded form are stored. These can be sent to F & K DELVOTEC to create a rapid, accurate failure and cause analysis.


In-head pull tester and in-line pull tester

  • In-head pull tester for non-destructive test of heavy aliminium wire bonds
  • In-line pull tester for rapid test of low wire count components such as lead frames, without slowing the production process.

The rapid, smooth set-up of ultrasonic systems in F & K DELVOTEC wire bonders is supported by sophisticated F & K DELVOTEC measurement and test equipment. 


 

F & K M17 Wire Bonder

Wire bonders from F & K DELVOTEC are more variable and reliable than any other comparable machine family in the world.

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Laser Bonder

Robust process for joining heavy wires and ribbons on DCB substrates and copper terminals in power electronics module packages.


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Bond Academy 

F & K DELVOTEC offers applications support, sample bonding, bond quality measurements and training throughout the lifetime of the wire bonders.


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