Wire Bonder

Wire Bonder F & K M17 Serie

Wire bonders from F & K DELVOTEC are more varied and reliable than any other machine family of its type in the world.

Wire Bonder F & K M17 Serie

Thanks to a tried and tested technology platform and comprehensive solutions for automation, wire bonders from F & K DELVOTEC are more varied and reliable than any other machine family of its type in the world.

High innovation and flexibility have been our secret for success for decades: exchanging bond heads on all M17 wire bonding machines in under 15 minutes, comprehensive solutions for automation and handling, applicable from small series to mass production and last, but not least, all current wire bond processes are covered.

The tried and tested technology building blocks create a final, unbeatable argument for the M17 in zero failure manufacture, in Automotive, Sensor production, PV-Industry and E-Mobility. 

Among the trade marks for the unique M17 platform are, standard bond heads, extremely precise piezo and linear drives, finely-adjusted drive and control technology, vibration suppressed chassis, drive and control software and camera supported quality tools during and after the process.

 

 

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Any questions about our wire bonders? We await your phone call or email

Tel:  +49 89 62995-122

Fax: +49 89 62995-101

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F & K M17S

The most reliable on the market
Fully automatic wire bonder with a single bond head

Joining Technology  Wire Bonding

  • Wedge-Wedge Fine Wire
  • Deep Access Wedge-Wedge Fine Wire
  • Wedge-Wedge Heavy Wire
  • Wedge-Wedge Heavy Ribbon

Applications and benefits
A process safe, all-in-one bonder for any demanding wire bonding process, particularly suitable for ball-wedge bonding in packages (deep access). 


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F & K M17D

The most productive on the market
Fully automatic wire bonder with two bond heads

Joining Technology Wire Bonding

  • Wedge-Wedge Fine Wire
  • Deep Access Wedge-Wedge Fine Wire
  • Wedge-Wedge Heavy Wire
  • Wedge-Wedge Heavy Ribbon

Application and benefits
Two different wire bonding processes at the same time on one machine, a space saving and safe process for high speed and high quality applications. 


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F & K M17L

The most flexible on the market
Biggest Work area for Fine Wire Bonding

Joining Technology Wire Bonding

  • Wedge-Wedge Fine Wire
  • Deep Access Wedge-Wedge Fine Wire
  • Wedge-Wedge Heavy Wire
  • Wedge-Wedge Heavy Ribbon

Application and benefits
Highest flexibility with combined manual and automatic parts handling:
Two manual work holders or single track indexer with manual work holder or Dual track indexer with bond-off station

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F & K M17XL

The biggest on the market
Fully automatic wird bonder with a huge work area

Joining Technology Wire Bonding

  • Wedge-Wedge Fine Wire
  • Deep Access Wedge-Wedge Fine Wire
  • Wedge-Wedge Heavy Wire
  • Wedge-Wedge Heavy Ribbon

Application and benefits
Work area of 1.130 mm x 700 mm, ideal for applications in the manufacture of solar modules or battery systems for the E-vehicle market.


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