F & K M17D

Wire Bonder F & K M17D – the first and only wire bonder with two heads on a single chassis

Highly productive and always aiming for zero defects: the fully automatic, compact wire bonder F & K M17D was adapted to the special requirements of mass production of power semiconductors and power modules in the automotive industry. It is the only wire bonder on the market offering the possibility to bond fine and heavy wire or heavy ribbon in a single machine.

Benefits

  • combination of fine and heavy wire in a single process
  • wire diameters from 17 to 600µm, ribbon dimensions 2.000 x 300µ
  • rapid and easy conversion in under 15 minutes
  • extremely space saving
  • Work area in mm: X=254 mm, Y= 153 mm (optionally 204 mm), z = 40mm (optionally 60 mm)
  • work area in inches:: X = 10", Y = 6" (optionally 8"), Z = 1,5" (optionally 2,3")
  • continuous monitoring and control of the bond process using the Bond Process Contol 
  • comprehensive automation from manual to in-line


Ask your question!

Any questions about our wire bonder?
We await your phone call or e-mail.

Tel:  +49 89 62995-122

Fax: +49 89 62995-101

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