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Exhibitions & Events

You will find the next exhibition dates of F & K DELVOTEC here. Come along and see us. We are looking forward to your visit!

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Keys to success

There are good reasons why F & K DELVOTEC is the world-wide leader in innovation for wire bonders. Here is a brief summary of the keys for success.

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Bond Academy

F & K DELVOTEC offers applications support, sample bonding, bond quality measurments and training throughout the lifetime of the wire bonders.

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Many convincing arguments for your future with F & K DELVOTEC

The compact, space saving wire bonder F & K Model 2017 S is a veritable multi-talent. It can be converted to any current wire bond process in a very short time.  For the highest productivity and the lowest operating costs the applications experts at F&K Delvotec determine the degree of automation for the customer product: Smartomation as guarantee for low Total Cost of Ownership.

Highly productive and always aiming for zero defects: the fully automatic, compact wire bonder F & K Model 2017 D was adapted to the special requirements of mass production of power semiconductors and power modules in the automotive industry. It is the only wire bonder on the market offering the possibility to bond fine and heavy wire or heavy ribbon in a single machine.

With the XL wire bonder, as so often in the past, F&K Delvotec engineering  accomplished innovative pioneering work. The largest work area in the world makes childs play of bonding large components such as battery modules for electro-vehicles or concentrator cells. A guarantee for the best quality and zero defect production: despite the large travelling distance the robotic arm remains vibration free and is positioned with micron accuracy.

With the world premier of their laser bonder in 2015, F&K Delvotec GmbH underlined once again the validity of its motto: Staying ahead in Bonding Technology. The completely new process, based on laser micro-welding, is particularly suitable for joining ribbon as well as bonding wire onto battery terminals and onto DCB substrates and copper terminals in power electronics modules. With laser bonding  the application of ribbon bonding for much higher currents is accomplished.

Our keys of success – Staying Ahead in Bonding Technology

Info

F & K DELVOTEC Bondtechnik recommends SMT-Tutorial 7 on May 17th 2017-how to secure Wirebonding Processes automatically
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F & K DELVOTEC announces partnership agreement with MTC
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New After Sales Center for your Service and Spare Parts Requests
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F & K DELVOTEC joined the NAATBatt Conference in Phoenix, Arizona
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F & K DELVOTEC Bondtechnik GmbH at the Battery Experts Forum of University Aschaffenburg
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F & K DELVOTEC Bondtechnik GmbH at MiNaPAD Forum Grenoble
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F & K DELVOTEC Bondtechnik at the SEMICON in Shanghai
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Mr. Robert Laberer
Tel.: +49 89 62995 333

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