Laser Tab Cu 300 - 800 µm

LSB means no welding mask, clamping is on the fly. Different product can be bond simultaneously simply via the programming.

Where performance heat path design requires sensitive substrates, the LSB process can deliver high current connections.

On typical 300µm Cu metallisation, the LSB can weld lead terminals up to 800µm with weld depth precision guaranteed through the fixed focus tool.