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18
Bonding
Ultrasonic fine wire Al
Ultrasonic fine wire Cu
Ultrasonic fine wire Au
Ultrasonic ball wedge Au
Ultrasonic ball wedge high access Au
Ultrasonic heavy wire Al 125 - 375 µm
Ultrasonic heavy wire Al 375 - 500 µm
Ultrasonic heavy wire Cu
Ultrasonic heavy ribbon Al
Ultrasonic deep access Al, AU
Laser simplification low induction Cu
Laser ribbon Cu
Laser ribbon Al
Laser PCB unsupported Al, Cu
Laser flex PCB ribbon Ni
Laser tab Al 0,5 - 2 mm
Laser Tab Cu 50 - 300 µm
Laser Tab Cu 300 - 800 µm
3
Machines
Ultrasonic wire bonder
Laser bonder
LAZ-Series
5
Services
Automation
Bond Academy
Service
Training
Return
4
Company
News
Locations
History
Events and exhibitions
3
Career
Corporate Group
Ottobrunn
Job and apprenticeship fairs
1
Contact
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Bonding
MEMS, SENSORS
>
Ultrasonic fine wire Al
Ultrasonic fine wire Cu
Ultrasonic fine wire Au
Ultrasonic ball wedge Au
Ultrasonic ball wedge high access Au
OPTO, RF/HF
>
Ultrasonic fine wire Al
Ultrasonic ball wedge Au
Ultrasonic ball wedge high access Au
Ultrasonic heavy ribbon Al
Ultrasonic deep access Al, AU
COB, HYBRID
>
Ultrasonic fine wire Al
Ultrasonic fine wire Au
Ultrasonic ball wedge Au
Ultrasonic heavy wire Al 125 - 375 µm
POWER DEVICES
>
Ultrasonic fine wire Al
Ultrasonic heavy wire Al 375 - 500 µm
Ultrasonic heavy wire Cu
Ultrasonic heavy ribbon Al
Laser ribbon Cu
Laser Tab Cu 300 - 800 µm
POWER SYSTEMS
>
Laser simplification low induction Cu
Laser ribbon Cu
Laser Tab Cu 300 - 800 µm
BMS
>
Ultrasonic heavy wire Al 125 - 375 µm
Laser ribbon Cu
Laser flex PCB ribbon Ni
Laser Tab Cu 50 - 300 µm
PCB, CASTING & AUTOMOTIVE
>
Ultrasonic heavy wire Al 125 - 375 µm
Laser ribbon Cu
Laser ribbon Al
Laser PCB unsupported Al, Cu
Laser Tab Cu 300 - 800 µm
CELLS
>
Ultrasonic heavy wire Al 375 - 500 µm
Laser ribbon Cu
Laser ribbon Al
Laser tab Al 0,5 - 2 mm
Laser Tab Cu 50 - 300 µm
Machines
Ultrasonic wire bonder
>
M17S: Fully automatic wire bonder with one bond head
M17D: Fully automatic wire bonder with two bond heads
M17L: Largest working range for thin wire bonding
M17XL: Fully automatic wire bonder with largest working range
Laser bonder
>
M17LSB L: Combination of laser welding and wire bonding
M17LSB XL: Combination of laser welding and wire bonding
LAZ-Series
>
DelvoLAZ
MegaLAZ
GigaLAZ
Services
Automation
Bond Academy
Service
Training
Return
Company
News
Locations
History
Events and exhibitions
Career
Corporate Group
Ottobrunn
Job and apprenticeship fairs
Contact
Contact form
Durchsuchen Sie unser Wissen
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F&K Delvotec
Company
Events and exhibitions
Events and exhibitions
SEMICON Taiwan
Platform for promoting the sustainable development of the semiconductor material industry
10.09.2025
-
12.09.2025
Taipei (TWN)
TaiNEX 1 & 2
Booth N0868
The Battery Show North America
North America's most comprehensive trade fair for modern batteries
06.10.2025
-
09.10.2025
Detroit (USA)
Huntington Place
Booth 2922
productronica
Leading trade fair for electronics development and manufacturing
18.11.2025
-
21.11.2025
Munich (GER)
Messe München
Hall B2 Booth 428
