Ultrasonic Laserbonder
Leading connection technology for large cable cross-sections in power electronics.
Ultrasonic Wire Bonder
Semi- and fully automated connection solutions for the sensor, semiconductor and automobile industry.
BPC Inside
Patented Bond Control System for real-time monitoring, setting and control of the bond quality.
Bond Academy
Best bond results through user trainings, knowledge transfer, consultation and useful services.
Many convincing arguments for your future with F & K DELVOTEC
Our keys of success – Staying Ahead in Bonding Technology
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