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Ultrasonic wire bonder

Connection solutions for sensor technology, semiconductors and automotive - optimised for highest quality and efficiency.

Laser bonder

An advanced connection technology for large wire cross-sections in power electronics.

Bond Academy

We offer consulting, services and analysis for optimised processes of our bonding procedures.

Training

We support with training courses around wire bonding and the operation of our machines.

Leader in Innovative Joining Technology

Since 1978, F & K DELVOTEC GmbH has played a decisive role in shaping the innovation landscape in the field of ultrasonic bonders. Its groundbreaking developments have had a decisive impact on the market and position the company as an innovation leader. Through an exceptionally high focus on research and development as well as close cooperation with leading companies and renowned research institutes, top performances have been achieved.

Bonding solutions by products

Select your product:
MEMS, SENSORS
OPTO, RF/HF
COB, HYBRID
POWER DEVICES
POWER SYSTEMS
BMS
PCB, CASTING & AUTOMOTIVE
CELLS
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Special requests?
We are happy to support you in the development of new products.
We find the right process.
Choose a process to learn more about it!
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News

Videos

Ultra Fine precision 40µm

Heavy Wire

Bond Process Control