Machines - Strama-MPS Maschinenbau

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We are specialists in packaging technology and have specialised in the development of reliable and economical solutions for contacting electronic components using ultrasonic technology since 1978.

With our robust and reliable laser bonding technology, we have enabled the contacting of thick aluminium and copper ribbons on DCB substrates and copper terminals since 2014, which is particularly advantageous in the booming market of power electronics.

Efficiency in perfection:

Our machines optimise your production process for maximum efficiency and precision. Higher productivity has never been so easy!

Hi-Tech innovation in action:

Discover the future of manufacturing technology with our innovative machines. Rely on top performance and reliability.

Confidence in every movement:

Rely on our machines to ensure smooth processes and error-free production. Highest quality you can count on.

Simplicity, performance, success:

Our machines offer ease of use, unmatched performance and the key to success in your production line.

THE SMALLEST

The one with the widest space utilisation.

THE MOST PRODUCTIVE

The one with two bonding heads for two different wire bonding processes

THE ONE SQUARED

The Single Machine²

THE BIGGEST

Our XL wire bonder - the innovation pioneer

THE FIRST OF ITS KIND

It starts where ultrasonic bonders end.

THE ONE IN XL FORMAT

Laser bonding in a larger working area made easy.

DELVOLAZ

Convinces with a working area of 1250x500x100 mm.

Megalaz

Offers state-of-the-art solutions for Cell-to-Module, Cell-to-Pack & Cell-to-Chassis.

Gigalaz

Offers state-of-the-art solutions for Cell-to-Module, Cell-to-Pack & Cell-to-Chassis.