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M17LSB L Laser bonder

The first of its kind

Its functionality comes into play where ultrasonic bonding reaches its technological limits.

Your products

OPTO, RF/HF
POWER DEVICES
POWER SYSTEMS
BMS
PCB, CASTING & AUTOMOTIVE
CELLS
Diode Laser
Circuit board
Capacitor
BMS
Cast housing
Battery module

The combination of wire bonding and laser welding was developed in cooperation with the Fraunhofer ILT Aachen.

It offers the perfect solution of terminal contacting for power modules as well as for battery assembly applications. Aluminium, copper or nickel ribbons are welded using laser energy with low bonding force. The process offers a wider range of different material joining partners compared to ultrasonic wire bonding and can be easily automated.

 

 

The advantages

  • Greater current-carrying capacity due to larger conductor cross-sections than with ultrasonic bonding
  • Low production costs due to low demands on the surface quality of the joining partners
  • Allows XYZ position tolerances compared to laser welding due to touch down sensor and image recognition
  • No mechanical damage to the components due to lower clamping forces of the component holder
  • Combines two processes on one machine without conversion: laser bonding of ribbons, laser tab bonding of connectors

 

The options

  • Tool cleaning

  • Suction

  • Manual hand pick-up

  • Customer-specific indexer system for components or workpiece carriers

  • Conveyor lines for in-line automation

M17LSB L: Combination of laser welding and wire bonding - Our technologies