Join us at SemiconSouthEastAsia!

We are pleased to participate in the international trade fair for semiconductor technology in Singapore! 

▸ Where? Sands Expo and Convention Centre
▸ When? May 20 - 22, 2025
▸ Booth: Booth 2624 - Level B2

As an innovation leader in joining technology, we look forward to presenting our innovative ultrasonic & laser bonding solutions and technologies. 

Come by, network with our team and discover what the future of bonding has in store!