Browse our knowledge
[Translate to English:]

Laser Tab Cu 300 - 800 µm

Power electronics & systems

Power electronics, lead terminals

Jig free zero gap Clamping on the fly

LSB means no welding mask, clamping is on the fly. Different product can be bond simultaneously simply via the programming.

High temperature DIP IPMs. Sensitive substrates

Where performance heat path design requires sensitive substrates, the LSB process can deliver high current connections.

800µm Lead terminal 300µm metallisation

On typical 300µm Cu metallisation, the LSB can weld lead terminals up to 800µm with weld depth precision guaranteed through the fixed focus tool.