45° feed pin to pad. To protect the delicate chip, the BPC allows of a soft process with perfect deformation for a consistent table tear.
Through the stability of our motion and a double reverse loop forming, we keep the wire precisely controlled through the largest of step downs.
Your loop library enables easy optimisation & flexibility.
Bond Force Ultrasonic power regulated in millisecond tact.
Extreme loop consistency loop height in HF through optimised wire feeding.
Optimal placement precision & loop control. The gold wires are formed with a cross groove tool.
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