BONDING

As specialists for assembly and connection technology, we have been committed to the further development of reliable and economical products and solutions for contacting electronic components since our foundation in 1978. 

In the field of wire bonding, F & K DELVOTEC develops holistic semi-automated or fully automated solutions for customers from the semiconductor industry, e-mobility, photovoltaic industry and automotive industry. The all-round service ranges from application consulting to the selection and configuration of the wire bonding machine to the connection of buffer stations and magazines as well as the integration of feeding systems.

The boom in the market for power electronics continues unabated. Since wire bonding has physical limits with regard to the transmittable currents, F & K DELVOTEC has developed a robust and extremely reliable technology within the scope of a joint project that allows the contacting of thick aluminium and copper ribbons on DCB substrates and copper terminals: laser bonding.